New chip packaging and 3D

[Wayne Morellini <waynemm@xxxxxxxxxxx>]

Quickly

Toshiba is using "Paper Thin Packaging"  (PTP) where they can stack 8 memory 
dies on top of each other.  The package comes in continuos tape with chips 
stuck on the package which has the leads on the surface. Maybe a good cheap 
process to stick a F21 and Memory closely bonded to gether for access speed.

Secondly, Microsoft is supporting a micro handheld browser protocoal called 
the Wireless application Protocol (WAP) running a reduced version of Windows 
CE.  A reduced target for new processors.

Thanks.

Been looking over SZ's Voxel stuff and I think that it's pretty good for the 
Misc integer series (if we only had F32 and F64's) if you have enough memory 
throughput and memory.  I think it is a great oppertunity for Misc in Voxel 
stuff.

Thanks SZ I got the attachments, will be spending some time during the 
vacation on them.

Wayne.
Wayne.


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